HARSH ENVIRONMENTS
Industrial strength
computing 
Immersion-cooled performance
with sealed protection
No matter the environment on the outside – dirty, dusty, wet, salty, etc. – your electronics will stay safe and running smoothly inside our sealed 
.
That’s because the ’s rugged, sealed (IP67) system reduces common causes of failure by isolating electronics from environmental impurities, dampening thermal cycling, and lowering operating temperatures. Industrial strength computing, anywhere.
Flexible, compatible
It’s compatible with Mini-ITX motherboard standards, handles low-to-high power applications — without requiring fans, air conditioning, or water – and can be deployed anywhere.
Plus, unlike sealed systems that are air-cooled, the performance is not limited by the lack of airflow. Our total immersion liquid cooling system provides 1,400 times more cooling power than air.
Patented immersion cooling
Using our patented Directed-FlowTM technology, we send the coolest fluid to the hottest electronic components first. Then the thermal transfer fluid immerses the other electronics to gather the remaining heat before leaving the chassis to be cooled and returned.
All of this makes the perfect for industrial applications in just about any environment where reliability, low maintenance, and equipment lifespan are paramount.
So, turn up the heat! can handle it.
See how you’ll save on capital and operating expenses >>
Learn more about our technology >>
features
- Can be deployed anywhere
- No A/C
- No water
- Low latency
- Siting flexibility
- High reliability
- Energy efficient
- Quiet operation
- Minimal maintenance
- Electronics protected from humidity, dust, oxidation, and corrosive gases
specifications
We are OEM and form factor agnostic and will configure a system for your application.
CPU
AMDRyzenTM M5 5600G-Series
Processor with RadeonTM Graphics
# of CPU Cores 6
# of Threads 12
Max. Boost Clock Up to 4.4GHz
Base Clock 3.9 GHz
L2 Cache 3MB
L3 Cache 16MB
Default TDP 65W
Temperature operating range: 32°F – 113°F (0°C – 45°C)
Memory
32GB DDR4 2933MHz
2×DDR4 SO-DIMM Slots
2933 / 2667 / 2400 / 2133
non-ECC, un-buffered
Max. system memory 64GB
Storage
SamsungTM 1TB M.2 980®
(UP TO 3,500/3,000MB/S)
Graphics
Integrated AMD RadeonTM “Zen3”
Graphics Core Count 7
Graphics Frequency 1900 MHz
LAN
PCIE x1 Gigabit LAN
10/100/1000 Mb/s
Realtek RTL8111GR
O.S. Support
Windows 11-64-Bit Edition
Windows 10-64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
Form Factor
Thin Mini-ITX 6.7-in x 6.7-in
17.0 cm x 17.0 cm
Power Supply
180W / 19VDC External Brick
Chassis
(IP67 )Rugged sealed enclosure protects electronics from oxidation, corrosion, dust, dirt, salt, humidity, and ESD
Dimensions w/HEX
W 16” – 40.6 cm
D 18” – 45.7 cm
H 4.5” – 11.4 cm
Fluid Capacity
1 gallon single phase heat transfer fluid is non-hazardous, eco-friendly, doesn’t evaporate or need to be replaced.